Back Grinding Tapes (BGT) are used in the semiconductor industry to protect wafers during the back grinding process. Back grinding is the process of grinding the back side of the wafer to make it thinner, and BGTs are used to protect the front side of the wafer, which contains sensitive components, during the process.
BGTs are made of a thin film with a pressure sensitive adhesive on one side that sticks to the wafer. The tape is designed to remain intact even after the back grinding process and can be easily removed from the wafer.
The increasing demand for semiconductor products is a major driver of the market. In addition, the growing need for advanced ICs and the rising use of advanced packaging technologies are expected to fuel the demand for BGTs. Furthermore, the development of low-temperature adhesives and the introduction of new technologies such as 3D ICs are anticipated to drive the market further.
The global Back Grinding Tapes (BGT) market was valued at US$ 187.7 million in 2022 and is anticipated to reach US$ 259.9 million by 2029, witnessing a CAGR of 4.9% during the forecast period 2023-2029. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
A detailed market research report on Global Back Grinding Tapes (BGT) Market available at: https://www.themarketreports.com/report/global-back-grinding-tapes-bgt-market-research-report
This report aims to provide a comprehensive presentation of the global market for Back Grinding Tapes (BGT), with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Back Grinding Tapes (BGT).
The world’s top five back grinding tapes (BGT) manufacturers include Mitsui Chemicals Tohcello, Nitto, LINTEC, Furukawa Electric, Denka., which together account for more than 85% of the market share, of which the largest producer is Mithui Chemicals Tohcello, accounting for more than 30% of the market. Japan is the world’s leading back-grinding tape production region, accounting for more than 40% of the market share. In terms of type, the market share of UV tape is more than 55%. In the application field, bump accounts for about 50% of the market share.
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