An Electrostatic Chuck (ESC) is a device used to hold a thin wafer in place during the fabrication process. It relies on the phenomenon of electrostatic attraction for this purpose. The ESC uses an electric field to create a “pull” on the wafer, holding it in place. This method of holding the wafer is preferred over mechanical clamping, as it is less likely to damage the wafer’s surface and other delicate features.
Electrostatic chucks are used in a wide range of applications including semiconductor device fabrication, microfabrication, thin-film deposition, etching and lithography. They are commonly used to secure a thin wafer to a substrate in the fabrication process. These devices are also used to hold light-sensitive materials, such as photoresist, in place during lithography.
The primary factors driving the market are the increasing demand for semiconductor devices, and the growing need for process optimization. The increasing demand for electronics and consumer products, such as smartphones, tablets, and laptops, is also driving the market. Moreover, the growing need for
The global Electrostatic Chucks for Wafer market was valued at US$ 223.7 million in 2022 and is anticipated to reach US$ 324.7 million by 2029, witnessing a CAGR of 5.4% during the forecast period 2023-2029. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
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This report aims to provide a comprehensive presentation of the global market for Electrostatic Chucks for Wafer, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Electrostatic Chucks for Wafer.
SHINKO dominated with 44.00% revenue market share, followed by TOTO with 17.00% revenue share and Creative Technology corporation with 9% revenue share.
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