Due to the COVID-19 pandemic, the global Through Glass Vias(TGV) Substrate market size is estimated to be worth US$ 82 million in 2022 and is forecast to a readjusted size of US$ 480.5 million by 2028 with a CAGR of 34.2% during the forecast period 2022-2028. Fully considering the economic change by this health crisis, 300 mm Wafer accounting for % of the Through Glass Vias(TGV) Substrate global market in 2021, is projected to value US$ million by 2028, growing at a revised % CAGR from 2022 to 2028. While Consumer Electronics segment is altered to an % CAGR throughout this forecast period.
At the regional level, the Chinese market has changed rapidly in the past few years, accounting for about 6% of the global market.
In terms of product type and technology, 300 mm wafers have the largest market share, accounting for about 48% of the global market.
In terms of product market application, the consumer electronics industry is the largest, accounting for about 50% of the global market share.
TGV substrate market pattern is highly concentrated, most of the test products and technologies are mastered by foreign manufacturers, including Corning, LPKF, Samtec, KSO Wave Co., Ltd.
And Tecnisco, etc.
Corning is the global leader in the TGV substrate industry, with a global market share of approximately 25%, and LPKF has a global market share of 19%.
Samtec has a 10% market share in the global TGV substrate market.
The research report has incorporated the analysis of different factors that augment the market’s growth. It constitutes trends, restraints, and drivers that transform the market in either a positive or negative manner. This section also provides the scope of different segments and applications that can potentially influence the market in the future. The detailed information is based on current trends and historic milestones. This section also provides an analysis of the volume of production about the global market and about each type from 2017 to 2028. This section mentions the volume of production by region from 2017 to 2028. Pricing analysis is included in the report according to each type from the year 2017 to 2028, manufacturer from 2017 to 2022, region from 2017 to 2022, and global price from 2017 to 2028.
A thorough evaluation of the restrains included in the report portrays the contrast to drivers and gives room for strategic planning. Factors that overshadow the market growth are pivotal as they can be understood to devise different bends for getting hold of the lucrative opportunities that are present in the ever-growing market. Additionally, insights into market expert’s opinions have been taken to understand the market better.
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The research report includes specific segments by region (country), by manufacturers, by Type and by Application. Each type provides information about the production during the forecast period of 2017 to 2028. by Application segment also provides consumption during the forecast period of 2017 to 2028. Understanding the segments helps in identifying the importance of different factors that aid the market growth.
Segment by Type
- 300 mm Wafer
- 200 mm Wafer
- Below 150 mm Wafer
Segment by Application
- Consumer Electronics
- Automotive Industry
- Kiso Wave Co., Ltd.
- Plan Optik
- Nsg Group
Production by Region
- North America
Consumption by Region
- North America (United States, Canada)
- Europe (Germany, France, U.K., Italy, Russia)
- Asia-Pacific (China, Japan, South Korea, India, Australia, China Taiwan, Indonesia, Thailand, Malaysia)
- Latin America (Mexico, Brazil, Argentina)
- Middle East & Africa (Turkey, Saudi Arabia, UAE)
Mr. Shirish Gupta
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