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4.3% CAGR to take Global Board Level EMI Shields Market to USD 530.1 Mn by 2027

The global Board Level EMI Shields market was valued at US$ 362.6 million in 2020 and it is expected to reach US$ 530.1 million by the end of 2027, growing at a CAGR of 4.3% during 2021-2027.

A Board Level Shield (BLS) is the most efficient and least expensive shielding solution and is used closest to the source of the problem. Board Level Shields (BLS) are designed to help optimize protection while meeting application requirements. In addition to a shielding of the electronic housing it may be useful or even necessary to shield the interference source directly on the Printed Circuit Board. This is often required to comply with current EMC laws relating to outgoing and incoming radiation and / or to guarantee the safe function of the assembly.

Global core board level EMI shields manufacturers include Shenzhen Evenwin and UIGreen etc. The Top 2 companies hold a share above 20%. Asia Pacific is the largest market, with a share about 77%, followed by North America and Europe with the share about 10% and 9%.

Global Board Level EMI Shields Market: Drivers and Restrains

The research report has incorporated the analysis of different factors that augment the market’s growth. It constitutes trends, restraints, and drivers that transform the market in either a positive or negative manner. This section also provides the scope of different segments and applications that can potentially influence the market in the future. The detailed information is based on current trends and historic milestones. This section also provides an analysis of the volume of production about the global market and about each type from 2016 to 2027. This section mentions the volume of production by region from 2016 to 2027. Pricing analysis is included in the report according to each type from the year 2016 to 2027, manufacturer from 2016 to 2021, region from 2016 to 2021, and global price from 2016 to 2027.

A thorough evaluation of the restrains included in the report portrays the contrast to drivers and gives room for strategic planning. Factors that overshadow the market growth are pivotal as they can be understood to devise different bends for getting hold of the lucrative opportunities that are present in the ever-growing market. Additionally, insights into market expert’s opinions have been taken to understand the market better.

Global Board Level EMI Shields Market: Segment Analysis

The research report includes specific segments by region (country), by manufacturers, by Type and by Application. Each type provides information about the production during the forecast period of 2016 to 2027.

Key Companies profiled in this report are Shenzhen Evenwin, UIGreen, Laird Technologies, Lada Industrial, AK Stamping, Shenzhen FRD, Tech-Etch, TE Connectivity, Leader Tech (HEICO), Ningbo Hexin Electronics, Kemtron, Harwin, Connor Manufacturing, Masach Tech, Bi-Link, Orbel Corporation, 3G Shielding Specialties, Würth Elektronik, AJATO, XGR Technologies, MAJR, Dongguan Kinggold and more in terms of market share by sales, revenue, average pricing, product type, margins, recent developments etc.

Find more details at:

Segment by Type

  • One-piece Board Level Shields
  • Two-piece Board Level Shields

Segment by Application

  • Consumer Electronics
  • Communication
  • Aerospace & Defense
  • Automotive Application

Table of Content:

1 Board Level EMI Shields Market Overview

2 Market Competition by Manufacturers

3 Production and Capacity by Region

4 Global Board Level EMI Shields Consumption by Region

5 Production, Revenue, Price Trend by Type

6 Consumption Analysis by Application

7 Key Companies Profiled

8 Board Level EMI Shields Manufacturing Cost Analysis

9 Marketing Channel, Distributors and Customers

10 Market Dynamics

11 Production and Supply Forecast

12 Consumption and Demand Forecast

13 Forecast by Type and by Application (2022-2027)

14 Research Finding and Conclusion

15 Methodology and Data Source

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Company Name: The Market Reports

Contact Person: Shirish Gupta


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