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High Density Interconnect PCB Market to Hit US$ 13600 Million by 2027, Growing at 7.0% CAGR – Research by The Market Reports

The global High Density Interconnect PCB market was valued at US$ 8203.5 million in 2020 and it is expected to reach US$ 13600 million by the end of 2027, growing at a CAGR of 7.0% during 2021-2027.

A high-density interconnect (HDI) is a fastest growing technology used in the printed circuit board (PCB), which have higher wiring density per unit as compared to the conventional circuit boards. These HDI PCBs have finer lines and spaces ( 100 m), smaller vias ( 150 m), and capture pads ( 400 m). Moreover, HDI PCBs have a relatively higher connection pad density over conventional PCBs that is over 20 pads/cm2. Hence, they are widely adopted in the consumer electronics sector and have a high growth potential in the automotive industry.

Global High Density Interconnect PCB Market: Drivers and Restrains

The research report has incorporated the analysis of different factors that augment the market’s growth. It constitutes trends, restraints, and drivers that transform the market in either a positive or negative manner. This section also provides the scope of different segments and applications that can potentially influence the market in the future. The detailed information is based on current trends and historic milestones. This section also provides an analysis of the volume of production about the global market and about each type from 2016 to 2027. This section mentions the volume of production by region from 2016 to 2027. Pricing analysis is included in the report according to each type from the year 2016 to 2027, manufacturer from 2016 to 2021, region from 2016 to 2021, and global price from 2016 to 2027.

A thorough evaluation of the restrains included in the report portrays the contrast to drivers and gives room for strategic planning. Factors that overshadow the market growth are pivotal as they can be understood to devise different bends for getting hold of the lucrative opportunities that are present in the ever-growing market. Additionally, insights into market expert’s opinions have been taken to understand the market better.

Global High Density Interconnect PCB Market: Segment Analysis

The research report includes specific segments by region (country), by manufacturers, by Type and by Application. Each type provides information about the production during the forecast period of 2016 to 2027.

Key Companies profiled in this report are TTM Technologies (US), PCBCART (China), Millennium Circuits Limited (US), RAYMING (China), Mistral Solutions Pvt. Ltd. (India), SIERRA CIRCUITS INC. (US), Advanced Circuits (US), FUJITSU INTERCONNECT TECHNOLOGIES LIMITED (Japan), FINELINE Ltd. (Israel), Austria Technologie & Systemtechnik Aktiengesellschaft (Austria) and more in terms of market share by sales, revenue, average pricing, product type, margins, recent developments etc.

Find more details at:

Segment by Type

  • Smartphone & Tablet
  • Laptop & PC
  • Smart Wearables
  • Others

Segment by Application

  • Consumer Electronics
  • Military And Defense
  • Telecom And IT
  • Automotive

Table of Content:

1 High Density Interconnect PCB Market Overview

2 Market Competition by Manufacturers

3 Production and Capacity by Region

4 Global High Density Interconnect PCB Consumption by Region

5 Production, Revenue, Price Trend by Type

6 Consumption Analysis by Application

7 Key Companies Profiled

8 High Density Interconnect PCB Manufacturing Cost Analysis

9 Marketing Channel, Distributors and Customers

10 Market Dynamics

11 Production and Supply Forecast

12 Consumption and Demand Forecast

13 Forecast by Typ           e and by Application (2022-2027)

14 Research Finding and Conclusion

15 Methodology and Data Source

Media Contact

Company Name: The Market Reports

Contact Person: Shirish Gupta


Phone: +1-631-407-1315